Join Teinnovations at Pack Expo ’24 in Chicago!

Ready for the biggest event in packaging? Teinnovations is excited to announce our return to Pack Expo 2024 in Chicago! We’re thrilled to showcase our latest solutions and explore how our packaging innovations can help transform your business.

Taking place from November 3 – 6 at the McCormick Place Convention Center in vibrant Chicago, this year’s expo will bring together over 2,600 exhibitors and 45,000+ of the industry’s brightest packaging and processing professionals.

Stop by Booth #LU-8120 to meet the Teinnovations team and discover how our extensive expertise in advanced packaging technology and food science can solve complex packaging challenges and enhance your product’s shelf life and quality.

This year, our booth will feature our latest innovations, including:

• Advanced high-barrier packaging solutions
• Versatile dual-ovenable packaging options
• Enhanced anti-fog technology
• HPP (High-Pressure Processing) ready packaging
• A wide range of innovative container designs
• High-performance sealing equipment for cups, bowls, and trays

Experience firsthand how our solutions can turn packaging challenges into success stories. Don’t miss your chance to stay ahead in the ever-evolving packaging industry.

For the latest updates on our Pack Expo 2024 participation, visit our dedicated landing page here. Get ready to explore the future of packaging with Teinnovations!

Join us at Booth #LU-8120 in the Lakeside Upper Hall (East Building) to see how we’re driving the future of packaging. We know McCormick Place can be overwhelming, so check out the maps below to find us. We can’t wait to connect with you. See you there!

Click here to learn more and stay tuned for exciting updates from Teinnovations.